Dom ProduktyŻywice Cyanate Ester

Cyanic Acid Cyanate Resin for Multi-chip Module , Oligomer BPCy 708TA

dobra jakość Bromowane środki zmniejszające palność na sprzedaż
dobra jakość Bromowane środki zmniejszające palność na sprzedaż
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Cyanic Acid Cyanate Resin for Multi-chip Module , Oligomer BPCy 708TA

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Cyanic Acid Cyanate Resin for Multi-chip Module , Oligomer BPCy 708TA dostawca Cyanic Acid Cyanate Resin for Multi-chip Module , Oligomer BPCy 708TA dostawca Cyanic Acid Cyanate Resin for Multi-chip Module , Oligomer BPCy 708TA dostawca Cyanic Acid Cyanate Resin for Multi-chip Module , Oligomer BPCy 708TA dostawca Cyanic Acid Cyanate Resin for Multi-chip Module , Oligomer BPCy 708TA dostawca

Duży Obraz :  Cyanic Acid Cyanate Resin for Multi-chip Module , Oligomer BPCy 708TA

Szczegóły Produktu:

Place of Origin: China
Nazwa handlowa: BPCy 708TA
Model Number: CAS no 25722-66-1

Zapłata:

Minimum Order Quantity: Negotiation
Cena: Negotiation
Packaging Details: 1000kgs IBC
Delivery Time: prompt
Payment Terms: Negotiation
Kontakt
Szczegółowy opis produktu
High Light:

thermoplastic resin

,

high temperature resin

Cyanic Acid Cyanate Resin for Multi-chip Module , Oligomer BPCy 708TA

 

 

1, Name:Cyanate Ester Resins
2, CAS No.:25722-66-1
3, Appearance:Light orange Liquid

4, Use:Multi-chip module,Aerospace prepregs,PCB

5, Fuction:good dielectric quality and low water absorbency, good mechanical quality and technological quality.
 

 

Description:

 

The dicyanate has good dielectric quality and low water absorbency, good mechanical quality and technological quality.

 

 

Applications:

  1. Laminating resin for high performance multi-layer PCB
  2. Multi-chip module
  3. Aerospace prepregs

 

Specifications:

 

Item

Value

Unit

Appearance

Liquid

Color

Light orange

Color

5.5-7.0

Gardner

Melting point

105

°C

Moisture

1.0 Max.

%

Chloride content

10 Max.

Mg/kg

 

 

Competitive Advantage:

 

Item

Value

Unit

Dielectric Constant

3.0 Max.

1MHz

Dissipation factor

0.005 Max.

1MHz

Glass transition temperature (TMA)

250 Min.

°C

Decomposition temperature

450 Min.

°C

Gel time

20 Min.

200°C/min

 

Szczegóły kontaktu
QINGDAO FUNDCHEM CO.,LTD.

Osoba kontaktowa: nicole.shi

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